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苏州市同博电子科技有限公司
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| 型号 | 8.9HF | 牌号 | indi |
|---|---|---|---|
| 加工定制 | 否 | 合金组份 | SAC305 |
| 类型 | 锡膏 | 清洗角度 | 免洗 |
| 适用范围 | 电子产品焊接 | 规格 | 8.9HF |
| 包装 | 罐装 | 重量 | 500g |
| 交货方式 | DDU | ||
Indium8.9HF is an air refl ow, no-clean solder pastespecifi cally formulated to accommodate the higherrocessing temperatures required by the Sn/Ag/Cu,Sn/Ag, and other alloy systems favored by the electronicsindustry to replace conventional Pb- bearing solders.Indium8.9HF offers unprecedented stencil print transfereffi ciency to work in the broadest range of processes.In addition, the high probe testability of Indium8.9HF
minimizes false failures in ICT.
